{"id":13915,"date":"2024-02-23T09:15:13","date_gmt":"2024-02-23T08:15:13","guid":{"rendered":"https:\/\/www.shincommunication.com\/?p=13915"},"modified":"2024-02-22T18:21:15","modified_gmt":"2024-02-22T17:21:15","slug":"analog-devices-e-tmsc-rafforzano-la-partnership","status":"publish","type":"post","link":"https:\/\/www.shincommunication.com\/fr\/analog-devices-e-tmsc-rafforzano-la-partnership\/","title":{"rendered":"Analog Devices e TMSC rafforzano la partnership"},"content":{"rendered":"<div style=\"background-repeat: no-repeat;\"><p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p><em>Grazie all\u2019accordo strategico con TSMC, tramite JASM, ADI rafforza le proprie capacit\u00e0 e la propria resilienza, assicurando la fornitura di chip<\/em> <em>a lungo termine e l&rsquo;accesso alle ultime tecnologie a 40nm e oltre<\/em><\/p>\n<p><a href=\"https:\/\/www.analog.com\/en\/index.html?ADICID=PRLS_EMEA_P1143250_ADI_TSMC\">Analog Devices, Inc.<\/a> (Nasdaq: <a href=\"http:\/\/finance.yahoo.com\/quote\/ADI?ltr=1\">ADI<\/a>) ha annunciato oggi la stipula di un accordo strategico con TSMC, principale fonderia mondiale dedicata esclusivamente ai semiconduttori. Lo scopo dell\u2019accordo \u00e8 la fornitura a lungo termine di wafer tramite la Japan Advanced Semiconductor Manufacturing, Inc. (\u201cJASM\u201d), filiale produttiva di propriet\u00e0 di maggioranza di TSMC nella prefettura di Kumamoto, in Giappone.<\/p>\n<p>ADI, in virt\u00f9 della partnership ultratrentennale con TSMC, ha cos\u00ec la possibilit\u00e0 di assicurarsi una disponibilit\u00e0 aggiuntiva di tecnologie fine pitch necessarie alle piattaforme cruciali utilizzate per il proprio business, tra cui le applicazioni wireless BMS (wBMS) e Gigabit Multimedia Serial Link (GMSL\u2122). L\u2019impegno congiunto mira a rinforzare la gi\u00e0 resiliente rete di produzione ibrida di ADI, con cui mitigare gli effetti dovuti a fattori esterni supportando al contempo i mezzi per aumentare la produzione e renderla rapidamente scalare per soddisfare le esigenze dei clienti.<\/p>\n<div id=\"attachment_13916\" style=\"width: 200px\" class=\"wp-caption alignleft\"><a href=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/ADI-Vivek-Jain.jpg\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-13916\" class=\"wp-image-13916 \" src=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/ADI-Vivek-Jain.jpg\" alt=\"\" width=\"190\" height=\"190\" srcset=\"https:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/ADI-Vivek-Jain.jpg 280w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/ADI-Vivek-Jain-150x150.jpg 150w\" sizes=\"auto, (max-width: 190px) 100vw, 190px\" \/><\/a><p id=\"caption-attachment-13916\" class=\"wp-caption-text\"><em>Vivek Jain<\/em><\/p><\/div>\n<p>\u201cLa nostra rete di produzione ibrida aiuta a fornire un vantaggio competitivo ai nostri clienti. Insieme a TSMC, possiamo supportarli con forniture pi\u00f9 resilienti, rispondere ancora pi\u00f9 velocemente alle loro esigenze e alle mutevoli condizioni del mercato, oltre che concentrare i nostri investimenti su soluzioni di produzione innovative a vantaggio della societ\u00e0 e del pianeta\u201d, ha commentato Vivek Jain, Executive Vice President of Global Operations &amp; Technology di ADI.<\/p>\n<div id=\"attachment_13920\" style=\"width: 220px\" class=\"wp-caption alignright\"><a href=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/TSMC-North-America-Sajiv-Dalal.jpg\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-13920\" class=\"wp-image-13920\" src=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/TSMC-North-America-Sajiv-Dalal-300x300.jpg\" alt=\"\" width=\"210\" height=\"210\" srcset=\"https:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/TSMC-North-America-Sajiv-Dalal-300x300.jpg 300w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/TSMC-North-America-Sajiv-Dalal-150x150.jpg 150w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2024\/02\/TSMC-North-America-Sajiv-Dalal.jpg 389w\" sizes=\"auto, (max-width: 210px) 100vw, 210px\" \/><\/a><p id=\"caption-attachment-13920\" class=\"wp-caption-text\"><em>Sajiy Dalal<\/em><\/p><\/div>\n<p>\u201cL\u2019annuncio di oggi dimostra l\u2019impegno di TSMC nell\u2019aiutare i clienti a soddisfare le loro esigenze di produzione a lungo termine\u201d, ha affermato Sajiv Dalal, Executive Vice President of Business Development di TSMC North America. \u201cSiamo lieti di espandere ulteriormente la collaborazione con ADI che contribuir\u00e0 a garantire un processo costante e dinamico di innovazione dei semiconduttori con solide capacit\u00e0 produttive\u201d.<\/p>\n<p>&nbsp;<\/p>\n<p>Per maggiori informazioni sulla resiliente rete di produzione ibrida di ADI, visitare <a href=\"https:\/\/www.analog.com\/en\/who-we-are\/resilient-hybrid-manufacturing.html\">https:\/\/www.analog.com\/en\/who-we-are\/resilient-hybrid-manufacturing.html<\/a>.<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<\/div><div style=\"padding-bottom:20px; padding-top:10px;\" class=\"hupso-share-buttons\"><!-- Hupso Share Buttons - http:\/\/www.hupso.com\/share\/ --><a class=\"hupso_toolbar\" href=\"http:\/\/www.hupso.com\/share\/\"><img decoding=\"async\" src=\"https:\/\/static.hupso.com\/share\/buttons\/share-small.png\" style=\"border:0px; padding-top:5px; float:left;\" alt=\"Share Button\"\/><\/a><script type=\"text\/javascript\">var hupso_services_t=new Array(\"Twitter\",\"Facebook\",\"Google Plus\",\"Pinterest\",\"Linkedin\",\"StumbleUpon\",\"Digg\",\"Reddit\",\"Bebo\",\"Delicious\");var hupso_background_t=\"#EAF4FF\";var hupso_border_t=\"#66CCFF\";var hupso_toolbar_size_t=\"small\";var hupso_image_folder_url = \"http:\/\/www.shincommunication.com\/wp-content\/plugins\/hupso-share-buttons-for-twitter-facebook-google\/img\/services\/\";var hupso_url_t=\"\";var hupso_title_t=\"Analog Devices e TMSC rafforzano la partnership\";<\/script><script type=\"text\/javascript\" src=\"https:\/\/static.hupso.com\/share\/js\/share_toolbar.js\"><\/script><!-- Hupso Share Buttons --><\/div>","protected":false},"excerpt":{"rendered":"<p>&nbsp; &nbsp; Grazie all\u2019accordo strategico con TSMC, tramite JASM, ADI rafforza le proprie capacit\u00e0 e la propria resilienza, assicurando la&#8230;<\/p>\n<div style=\"padding-bottom:20px; padding-top:10px;\" class=\"hupso-share-buttons\"><!-- Hupso Share Buttons - http:\/\/www.hupso.com\/share\/ --><a class=\"hupso_toolbar\" href=\"http:\/\/www.hupso.com\/share\/\"><img src=\"https:\/\/static.hupso.com\/share\/buttons\/share-small.png\" style=\"border:0px; padding-top:5px; float:left;\" alt=\"Share Button\"\/><\/a><script type=\"text\/javascript\">var hupso_services_t=new Array(\"Twitter\",\"Facebook\",\"Google Plus\",\"Pinterest\",\"Linkedin\",\"StumbleUpon\",\"Digg\",\"Reddit\",\"Bebo\",\"Delicious\");var hupso_background_t=\"#EAF4FF\";var hupso_border_t=\"#66CCFF\";var hupso_toolbar_size_t=\"small\";var hupso_image_folder_url = \"http:\/\/www.shincommunication.com\/wp-content\/plugins\/hupso-share-buttons-for-twitter-facebook-google\/img\/services\/\";var hupso_url_t=\"\";var hupso_title_t=\"Analog Devices e TMSC rafforzano la partnership\";<\/script><script type=\"text\/javascript\" src=\"https:\/\/static.hupso.com\/share\/js\/share_toolbar.js\"><\/script><!-- Hupso Share Buttons --><\/div>","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3],"tags":[2436,2092,2378,2165,2228,295],"class_list":["post-13915","post","type-post","status-publish","format-standard","hentry","category-analogdevices","tag-innovation","tag-produzione","tag-resilienza","tag-semiconductor","tag-supply-chain","tag-tecnologia"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.3.1 - 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