
{"id":6626,"date":"2020-09-22T21:08:54","date_gmt":"2020-09-22T19:08:54","guid":{"rendered":"http:\/\/www.shincommunication.com\/?p=6626"},"modified":"2023-03-09T15:21:06","modified_gmt":"2023-03-09T14:21:06","slug":"analog-devices-e-microsoft-per-limaging-3d","status":"publish","type":"post","link":"https:\/\/www.shincommunication.com\/de\/analog-devices-e-microsoft-per-limaging-3d\/","title":{"rendered":"Analog Devices e Microsoft per l\u2019imaging 3D"},"content":{"rendered":"<div style=\"background-repeat: no-repeat;\"><p><em>ADI e Microsoft collaborano per la realizzazione di prodotti e soluzioni all&#8217;avanguardia\u00a0nel settore dell\u2019imaging 3D<\/em><\/p>\n<p><a href=\"http:\/\/www.analog.com\/?ADICID=PRLS_EMEA_P311801_Microsoft\">Analog Devices, Inc.<\/a> (Nasdaq: ADI) annuncia oggi una collaborazione strategica con <a href=\"https:\/\/www.microsoft.com\/en-us\/\">Microsoft Corp.<\/a> per valorizzare la tecnologia dei sensori per il Time of Flight 3D (ToF) di Microsoft, consentendo ai clienti di creare facilmente applicazioni 3D ad alte prestazioni con un maggiore grado di precisione e che lavorino indipendentemente dalle condizioni ambientali del contesto. La competenza tecnica di ADI combinata con la tecnologia Microsoft Azure Kinect fornir\u00e0 soluzioni leader ToF a un pubblico molto pi\u00f9 ampio in settori quali industria 4.0, automotive, videogiochi, realt\u00e0 aumentata, fotografia computazionale e videografia.<\/p>\n<p><a href=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\" wp-image-6627 alignleft\" src=\"http:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800-300x300.jpg\" alt=\"\" width=\"770\" height=\"770\" srcset=\"https:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800-300x300.jpg 300w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800-150x150.jpg 150w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800-768x768.jpg 768w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800-1024x1024.jpg 1024w, https:\/\/www.shincommunication.com\/wp-content\/uploads\/2020\/09\/Press-Release-Microsoft-Partner-Graphic_Full-1800x1800.jpg 1800w\" sizes=\"auto, (max-width: 770px) 100vw, 770px\" \/><\/a>Attualmente, il mercato industriale sta registrando una crescita per i sistemi di imaging 3D che possono essere utilizzati in ambienti critici e che richiedono applicazioni all&#8217;avanguardia, ad esempio cobot, mappatura degli ambienti e sistemi di gestione dell&#8217;inventario per accelerare la transizione verso l\u2019industria 4.0. Le applicazioni ToF sono necessarie anche per poter creare una migliore esperienza di guida sulle vetture di nuova generazione, pi\u00f9 sicure per il conducente e i passeggeri, equipaggiando i veicoli con capacit\u00e0 di rilevamento di presenza e monitoraggio del conducente.<\/p>\n<p>&#8222;I nostri clienti richiedono un&#8217;acquisizione della profondit\u00e0 dell&#8217;immagine che &#8222;funzioni e basta&#8220; e sia facile come scattare una foto&#8220;, ha dichiarato Duncan Bosworth, General Manager, Consumer Business Unit, Analog Devices. &#8222;La tecnologia dei sensori ToF 3D di Microsoft utilizzata nei dispositivi HoloLens a realt\u00e0 mista e nel kit di sviluppo Azure Kinect \u00e8 considerata lo standard di riferimento per le tecnologie ToF. Combinando questa tecnologia con le soluzioni personalizzate di ADI, i nostri clienti potranno facilmente implementare e rendere scalabile la nuova generazione di applicazioni ad alte prestazioni, pronte all\u2019uso&#8220;.<\/p>\n<p>Analog Devices sta progettando, producendo e commercializzando una nuova serie di registratori di immagine ToF 3D, laser driver, sistemi basati su software e hardware per la misura della profondit\u00e0, che forniranno la migliore risoluzione sul mercato con una precisione inferiore al millimetro.<\/p>\n<p>&nbsp;<\/p>\n<p>ADI inizier\u00e0 a realizzare sistemi completi basati su sensori d\u2019immagine CMOS per fornire immagini 3D altamente dettagliate, operanti a distanze maggiori e con prestazioni robuste indipendentemente da ci\u00f2 che si trova nel campo visivo. Questa piattaforma fornir\u00e0 ai clienti funzionalit\u00e0 plug and play per un&#8217;implementazione rapida e su larga scala.<\/p>\n<p>&#8222;Analog Devices \u00e8 un\u2019azienda all&#8217;avanguardia nella traduzione di fenomeni fisici in informazioni digitali&#8220;, ha dichiarato Cyrus Bamji, Microsoft Partner Hardware Architect, Microsoft. &#8222;Questa collaborazione amplier\u00e0 la presenza sul mercato della tecnologia dei nostri sensori ToF e permetter\u00e0 lo sviluppo di sensori 3D commerciali, telecamere e soluzioni correlate, che saranno compatibili con un ecosistema Microsoft costruito su piattaforme Microsoft depth, Intelligent Cloud e Intelligent Edge&#8220;.<\/p>\n<p>La tecnologia dei sensori 3D ToF proietta una luce laser controllata con precisione della durata di nanosecondi, che viene riflessa dalla scena su di un sensore di immagine ad alta risoluzione che fornisce una stima della profondit\u00e0 per ogni pixel dell&#8217;array di immagine. I nuovi prodotti CMOS ToF di ADI, basati sulla tecnologia Microsoft, consentiranno una misura molto accurata della profondit\u00e0, un basso rumore, un&#8217;elevata robustezza all&#8217;interferenza multipath oltre a soluzioni di calibrazione per una produzione semplificata. I prodotti e le soluzioni ADI sono gi\u00e0 in fase di campionamento e si prevede che i primi prodotti per l\u2019imaging 3D con tecnologia Microsoft verranno rilasciati entro la fine del 2020.<\/p>\n<p>Per maggiori informazioni, visitare <a href=\"http:\/\/www.analog.com\/TOF?ADICID=PRLS_EMEA_P311801_Microsoft\">http:\/\/www.analog.com<\/a><\/p>\n<\/div><div style=\"padding-bottom:20px; padding-top:10px;\" class=\"hupso-share-buttons\"><!-- Hupso Share Buttons - http:\/\/www.hupso.com\/share\/ --><a class=\"hupso_toolbar\" href=\"http:\/\/www.hupso.com\/share\/\"><img decoding=\"async\" src=\"https:\/\/static.hupso.com\/share\/buttons\/share-small.png\" style=\"border:0px; padding-top:5px; float:left;\" alt=\"Share Button\"\/><\/a><script type=\"text\/javascript\">var hupso_services_t=new Array(\"Twitter\",\"Facebook\",\"Google Plus\",\"Pinterest\",\"Linkedin\",\"StumbleUpon\",\"Digg\",\"Reddit\",\"Bebo\",\"Delicious\");var hupso_background_t=\"#EAF4FF\";var hupso_border_t=\"#66CCFF\";var hupso_toolbar_size_t=\"small\";var hupso_image_folder_url = \"http:\/\/www.shincommunication.com\/wp-content\/plugins\/hupso-share-buttons-for-twitter-facebook-google\/img\/services\/\";var hupso_url_t=\"\";var hupso_title_t=\"Analog Devices e Microsoft per l\u2019imaging 3D\";<\/script><script type=\"text\/javascript\" src=\"https:\/\/static.hupso.com\/share\/js\/share_toolbar.js\"><\/script><!-- Hupso Share Buttons --><\/div>","protected":false},"excerpt":{"rendered":"<p>ADI e Microsoft collaborano per la realizzazione di prodotti e soluzioni all&#8217;avanguardia\u00a0nel settore dell\u2019imaging 3D Analog Devices, Inc. (Nasdaq: ADI)&#8230;<\/p>\n<div style=\"padding-bottom:20px; padding-top:10px;\" class=\"hupso-share-buttons\"><!-- Hupso Share Buttons - http:\/\/www.hupso.com\/share\/ --><a class=\"hupso_toolbar\" href=\"http:\/\/www.hupso.com\/share\/\"><img src=\"https:\/\/static.hupso.com\/share\/buttons\/share-small.png\" style=\"border:0px; padding-top:5px; float:left;\" alt=\"Share Button\"\/><\/a><script type=\"text\/javascript\">var hupso_services_t=new Array(\"Twitter\",\"Facebook\",\"Google Plus\",\"Pinterest\",\"Linkedin\",\"StumbleUpon\",\"Digg\",\"Reddit\",\"Bebo\",\"Delicious\");var hupso_background_t=\"#EAF4FF\";var hupso_border_t=\"#66CCFF\";var hupso_toolbar_size_t=\"small\";var hupso_image_folder_url = \"http:\/\/www.shincommunication.com\/wp-content\/plugins\/hupso-share-buttons-for-twitter-facebook-google\/img\/services\/\";var hupso_url_t=\"\";var hupso_title_t=\"Analog Devices e Microsoft per l\u2019imaging 3D\";<\/script><script type=\"text\/javascript\" src=\"https:\/\/static.hupso.com\/share\/js\/share_toolbar.js\"><\/script><!-- Hupso Share Buttons --><\/div>","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3],"tags":[2083,909,2295,2297,1351,2296,1070,2294],"class_list":["post-6626","post","type-post","status-publish","format-standard","hentry","category-analogdevices","tag-3d","tag-analog-devices","tag-azure","tag-cmos","tag-imaging","tag-kinect","tag-microsoft","tag-time-of-flight"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.3.1 - 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